Interconnect for electrically connecting a multichip module to a circuit substrate and processes for making and using same

ABSTRACT

An interconnect for attaching a module such as a PCB or a multi-chip module to a circuit substrate comprises a member elongated in a longitudinal direction. The member has at least a first elongated side and a second opposed and generally parallel elongated side. The first and second sides extend in the longitudinal direction. Each of the first and second sides have at least one portion formed by a series of depressions in the respective first and second sides. The depressions extend inwardly from a first outer surface of the first side and a second outer surface of the second side. The depressions are metallized to form leads. A circuit assembly is also provided comprising a multi-chip module having a plurality of electronic elements; a circuit substrate supporting thereon a conductive circuit pattern adapted for connection to the multi-chip module and at least one the interconnects for attaching the multi-chip module to the circuit pattern on the circuit substrate. A process for making the interconnect and a process for assembling the circuit assembly is also provided.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to an interconnect havingperipheral leads. The interconnect is particularly adapted forconnecting a multi-chip module or a PCB to a circuit substrate such as aPCB to form a circuit assembly. The invention also relates to processesfor making and using an interconnect having peripheral leads.

[0003] 2. Brief Description of Prior Developments

[0004] Numerous interconnect devices are employed in electronicpackaging for electronic devices. U.S. Pat. Nos. 5,558,271, 6,034,423,6,041,495, and 6,071,754 illustrate many of these approaches such as theuse of lead and tape frames, ball grid arrays, and flip-chipinterconnects.

[0005] Pin and socket type interconnects for stacking modules aredescribed in U.S. Pat. Nos. 5,460,531 and 5,613,033.

[0006] U.S. Pat. No. 5,069,626 discloses a semiconductor device packagecomprising a molded polymeric substrate having castellated leads. Theinterconnect of this electronic package does not connect a multi-chipmodule or a PCB to a circuit board. It is a component package providingan integrated circuit to board connection. In contrast in accordancewith this invention a multi-chip device package or PCB is connected to acircuit substrate or PCB by a separate interconnect member having leadsin peripheral depressions.

[0007] U.S. Pat. No. 5,247,423 discloses stackable multi-chip modulesemploying a plurality of edge metal conductors that form half-vias whichprovide a castellated appearance. Solder plated wires are fitted withinthe half-vias and reflowed to the conductor traces to interconnect thesemiconductor devices of the modules. In contrast in accordance withthis invention a multi-chip device package or PCB is connected to acircuit substrate by a separate interconnect member having leads inperipheral depressions.

SUMMARY OF THE INVENTION

[0008] In accordance with one preferred embodiment of the invention aninterconnect is provided for attaching a module such as a PCB or amulti-chip module to a circuit substrate. A member elongated in alongitudinal direction has at least a first elongated side and a secondopposed and generally parallel elongated side. The first and secondsides extend in a longitudinal direction. Each of the first and secondsides has at least one portion formed by a series of depressions in therespective first and second sides extending inwardly from a first outersurface of the first side and a second outer surface of the second side.The depressions are metallized to form leads.

[0009] In accordance with another preferred embodiment of the inventiona multi-chip module circuit assembly is provided comprising a multi-chipmodule, a circuit substrate and at least one interconnect. Themulti-chip module includes a plurality of electronic elements. Thecircuit substrate supports a conductive circuit pattern adapted forconnection to the multi-chip module. At least one interconnect inaccordance with the previous embodiment attaches the multi-chip moduleto the circuit pattern on the circuit substrate. The leads of theinterconnect member connect at least one of the electronic elements ofthe multi-chip module to the conductive circuit pattern of the circuitsubstrate. The circuit assembly preferably includes a plurality of theinterconnect members of this invention connected between the multi-chipmodule and the circuit substrate.

[0010] In a particularly preferred embodiment of the circuit assemblythe multi-chip module includes a first major face and a second opposedmajor face. First electronic elements are supported on the first faceand additional second electronic elements are supported on the secondface. The interconnect members space the multi-chip module from thecircuit substrate by an amount greater than the thickness of electronicelements arranged on the multi-chip module between the multi-chip moduleand the circuit substrate. Preferably at least two of the interconnectmembers connect the multi-chip module to the circuit substrate.

[0011] In accordance with yet another preferred embodiment of theinvention a process for making an interconnect for attaching amulti-chip module to a circuit substrate is provided. The processescomprises providing a member elongated in a longitudinal direction. Aseries of circuit pads are formed on opposing major faces of the member.The circuit pads are arranged in at least two lines in the longitudinaldirection on each of the major faces. The circuit pads in a line on onemajor face of the member are aligned with respective opposing circuitpads on the other major face of the member. A series of openings areformed in the circuit pads. The openings extend through the member andat least one circuit pad on one of the major faces and at least anothercircuit pad on the opposing major face. The openings are arranged in theat least two lines. A conductive metalization is formed in the openingsfor electrically connecting each of the one circuit pads to a respectiveone of the another circuit pads. The member is divided along a generallycentral axis of the openings in the at least two lines to provide atleast one interconnect member as described in the first embodiment ofthe invention.

[0012] In accordance with a still further preferred embodiment of theinvention a process is provided for attaching a multi-chip module to acircuit substrate. The process of this embodiment comprises providing amulti-chip module, a circuit substrate and at least one interconnectmember of the type described in the previous preferred embodiments. Themulti-chip module has a plurality of electronic elements. The circuitsubstrate supports thereon a conductive circuit pattern adapted forconnection to the multi-chip module. The at least one interconnectmember includes metallized depressions which form leads for connectingat least one electronic element of the multi-chip module to theconductive circuit pattern of the circuit substrate. A sub-assembly isformed by attaching the at least one interconnect member to themulti-chip module to make a desired electrical connection between atleast one of the leads of the interconnect member and the at least oneelectronic element. The sub-assembly is then attached to the circuitsubstrate to make at least one desired electrical connection between theat least one lead of the interconnect member and the conductive circuitpattern of the circuit substrate.

[0013] In a particularly preferred embodiment of this process embodimentthe multi-chip module includes a first major face and a second opposedmajor face. First electronic elements are supported on the first faceand additional second electronic elements are supported on the secondface. The interconnect members are formed so as to space the multi-chipmodule from the circuit substrate by an amount greater than thethickness of electronic elements arranged on the multi-chip modulebetween the multi-chip module and the circuit substrate. Preferably atleast two of the interconnect members are connected between themulti-chip module and the circuit substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The method and connector of the present invention is furtherdescribed with reference to the accompanying drawings in which:

[0015]FIG. 1 is a top plan view of a multi-chip module havinginterconnect members placed on it in accordance with the presentinvention;

[0016]FIG. 2 is a side elevational view of a multi-chip module connectedby interconnects in accordance with this invention to a circuitsubstrate;

[0017]FIG. 3 is an exemplary partial top view of a circuit substrateshowing one of many versions of a pattern of conductive circuit tracesor conductors;

[0018]FIG. 4 is a partial top view of an interconnect member inaccordance with a preferred embodiment of this invention during a firststage of its fabrication.

[0019]FIG. 5 is a partial top view of an interconnect member inaccordance with a preferred embodiment of this invention during afurther stage of its fabrication.

[0020]FIG. 6 is a partial top view of an interconnect member inaccordance with a preferred embodiment of this invention during afurther stage of its fabrication.

[0021]FIG. 7 is a partial top view of an interconnect member inaccordance with a preferred embodiment of this invention during afurther stage of its fabrication.

[0022]FIG. 8 is a top view of a singulated interconnect member inaccordance with a preferred embodiment of this invention.

[0023]FIG. 9 is a partially cross sectional view illustrating anexemplary embodiment of the process for forming the openings in theinterconnect member;

[0024]FIG. 10 is a partial perspective view of the interconnect membercastellations after plating with a conductive material;

[0025]FIG. 11 is a partial perspective view of the interconnect membercastellations after plating with solder; and

[0026]FIG. 12 is a top view of interconnect members in accordance withanother preferred embodiment of the invention wherein the members aresupported by a tape like carrier for reel feeding to an assemblystation.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] While the present invention will hereinafter be described inconnection with preferred embodiments thereof, it will be understoodthat it is not intended to limit the invention to that embodiment. Onthe contrary, it is intended to cover all alternatives, modificationsand equivalents as may be included within the spirit and scope of theinvention as defined by the appended claims.

[0028] Referring now to FIGS. 1 and 2 there is shown a multi-chip module10. The module 10 can have any desired design. Generally it comprises acircuit substrate 12 which may comprise a printed circuit board. Thesubstrate 12 may be formed of any conventional material such as ceramicor polymers or glass filled polymers such as FR4. The substrate 10shown, for example, is a printed circuit board formed from a laminate,comprising a glass filled polymer core clad with a thin copper layer oneach side of the core. If desired the substrate can be a multilayerboard having additional copper layers intermediate the clad copperlayers. The copper clad layers may be patterned by conventionalphotolithographic techniques to form a desired circuit pattern 14. Aplurality of electronic devices 16, 18, 20, are mounted to the circuitsubstrate 12 and connected to the circuit pattern 14 or traces byconventional means such as, for example, surface mounting. Theelectronic devices 16, 18, 20 may be any desired device such as, forexample, integrated circuits. In a general sense the substrate 12 couldbe a PCB for use other than as a multi-chip module.

[0029] Typically multi-chip modules 10 have electronic devices on oneside and are attached to a circuit substrate, such as circuit board 22,by a conventional interconnect such as pins, ball grid array, etc. Thecircuit board 22 may be of any conventional design and is generallyconstructed of materials similar to the circuit substrate 12 andincludes circuit patterns or traces 62 for interconnecting electronicdevices formed in a manner similar to the circuit pattern 14.

[0030] In accordance with this invention, the multi-chip module 10preferably includes one or more electronic devices 19, 21 on a firstmajor face 26 and one or more electronic devices 23 on the second majorface 24 of the circuit substrate 12. The electronic devices 19 and 21 onthe bottom of the module 10 make the use of conventional interconnects,particularly surface mount interconnects, impractical.

[0031] In accordance with one preferred embodiment of the invention aninterconnect 30 is provided for attaching a multi-chip module 10 or PCBto a circuit substrate 22 which can be a PCB. A member 32 elongated inthe longitudinal direction of axis (A) has at least a first elongatedside 34 and a second opposed and generally parallel elongated side 36.The first 34 and second 36 sides extend in the longitudinal direction.Each of the first and second sides 34, 36 has at least one portion 38formed by a series of depressions 40 in the respective first and secondsides 34, 36 extending inwardly from a first outer surface 42 of thefirst side 34 and a second outer surface 44 of the second side 36. Thedepressions 40 are metallized in the manner, which will be describedlater to form leads.

[0032] In use, the interconnect members 30 act both as leads connectingthe circuitry of the module 10 to the circuitry of the substrate 22 andas standoffs which support the multi-chip module above the circuitsubstrate 22 to provide a gap (B) which is greater than the thickness ofthe electronic devices 19, 21 on the bottom of the module 10.

[0033] The depressions 40 preferably have a generally semi-cylindricalshape. Each of the first and second sides 34, 36 extends from a firsttransverse end 42 of the interconnect member 32 to a second transverseend 44 of the member. Each of the sides 34 and 36 further includes atleast one portion 46, 46′, intermediate the ends 42, 44, which isdepression free. The member 32 further includes third 48 and forth 50opposed elongated sides extending respectively between the first andsecond sides 34, 36. The portion of each of the third and fourth sides48, 50 associated with the portions 46, 46′ of the first and secondsides 34, 36 are designed for receiving a pick and place assemblydevice.

[0034] In accordance with another preferred embodiment of the inventiona multi-chip module circuit assembly 60 is provided which comprises amulti-chip module 10, a circuit substrate 22 and at least oneinterconnect 30. The multi-chip module 10 includes a plurality ofelectronic elements 16, 18-21. The circuit substrate 22 supports aconductive circuit pattern 62 (FIG. 3) adapted for connection to themulti-chip module 10. At least one interconnect 30 in accordance withthe previous embodiment attaches the multi-chip module 10 to the circuitpattern 62 on the circuit substrate 22. The leads 96 (FIG. 11) of theinterconnect member 10 connect at least one of the electronic elements16, 18-21 of the multi-chip module 10 to the conductive circuit pattern62 of the circuit substrate. The circuit assembly 60 preferably includesa plurality of the interconnect members 30, such as the two shown,connected between the multi-chip module 30 and the circuit substrate 22.If desired more than two interconnects 30 can be employed.

[0035] In a particularly preferred embodiment of the circuit assembly 60the multi-chip module 10 includes a first major face 24 and a secondopposed major face 26. First electronic elements 16, 18-20 are supportedon the first face 24 and additional second electronic elements 19, 20are supported on the second face 26. Each face 24, 26 may have anydesired number of electronic devices. The interconnect members 32 spacethe multi-chip module 10 from the circuit substrate 22 by an amountgreater than the thickness of electronic elements 19, 21 arranged on themulti-chip module 10 between the module and the circuit substrate 22. Inaccordanace with a preferred embodiment of the invention theinterconnects are located toward an adjacent side 70, 72 of the module10.

[0036]FIG. 3 shows a circuit pattern 62 on a typical circuit substrate22 for connection to the interconnect 30 of this invention. A similarpattern 74 is present on the module 10 as shown in FIG. 1. Each of thecircuit patterns 62 and 74 includes circuit traces 64, 76 whichterminate at interconnect circuit pads 66, 78. The circuit pads 66, 78may have any desired diameter and spacing as are conventional in theart. The castellations 38 of the interconnect member 32 are arranged incorrespondence with the pads 66, 78 positions so that in use the pads66, 78 lie under the respective ends of the depressions 40.

[0037] Referring now to FIGS. 1-8 in accordance with yet anotherpreferred embodiment of the invention a process for making aninterconnect 30 for attaching a multi-chip module 10 to a circuitsubstrate 22 is provided. The process comprises providing a member 32elongated in the longitudinal direction. A series of circuit pads 80 areformed on opposing major faces 48, 50 of the member 32. The circuit pads80 are arranged in at least two lines 82, 84 in the longitudinaldirection on each of the major faces 48, 50. The circuit pads 80 in aline 82, 84 on one major face 48 of the member 32 are aligned withrespective opposing circuit pads 80′ on the other major face 50 of themember 32 in a similar manner (FIG. 9). The pads 80, 80′ may have anydesired shape, however, an oval shape as shown is preferred.

[0038] A series of openings 86 are formed in the member 32 and thecircuit pads 80, 80′. The openings 86 extend through the member 32 andat least one circuit pad 80 on one of the major faces 48 and at leastanother circuit pad 80′ on the opposing major face 50 as shown in FIG.9. The openings are arranged in the at least two lines 90 and 92 (FIG.5). A conductive metalization 88 is formed in the openings 86 forelectrically connecting each of the circuit pads 80 to a respectivecorresponding circuit pad 80′. The member 32 is then divided along thegenerally central axes 90, 92 of the openings 86 in the at least twolines, to provide at least one interconnect member 32 as described infirst embodiment of the invention.

[0039] In accordance with a still further preferred embodiment of theinvention a process is provided for attaching a multi-chip module 10 toa circuit substrate 22. The process of this embodiment comprisesproviding a multi-chip module 10, a circuit substrate 22 and at leastone interconnect member 32 of the type described in the previouspreferred embodiments. The multi-chip module 10 has a plurality ofelectronic elements 16, 18-21. The circuit substrate 22 supports thereona conductive circuit pattern 62 adapted for connection to the multi-chipmodule 10. The at least one interconnect member 32 has leads 96 (FIG.11) for electrically connecting at least one electronic element 16,18-21 of the multi-chip module 10 to the conductive circuit pattern 62of the circuit substrate 22. A sub-assembly 60 is formed by attachingthe at least one interconnect member 32 to the multi-chip module 10 tomake a desired electrical connection between at least one of the leads96 of the interconnect member 32 and the circuit pattern 74 which iselectrically connected to the at least one electronic element 16, 18-21.The partially assembled sub-assembly 60 is then attached to the circuitsubstrate 22 so that the at least one interconnect member 32 makes atleast one desired electrical connection between the at least one lead 96of the interconnect member and the conductive circuit pattern 74 of thecircuit substrate 22.

[0040] Preferably at least two or more of the interconnect members 32are connected between the multi-chip module 10 and the circuit substrate22. The interconnect members may be located on the multi-chip module 10toward the adjacent sides 70, 72 of the module 10 to provide improvedstructural integrity.

[0041] The invention will now be described by way of a detailed examplebut it is not intended to limit the invention to this specific approachand numerous other ways of carrying out the invention are possible. Thisparticular example utilizes two intermediary PCBs (printed circuitboards) as interconnect members 32 with “plated through-holes” that arerouted through and plated-up to serve as leads. However, any desiredmethod for making the interconnect members 32 can be employed. While itis preferred to start with conventional PCB board materials using glassfilled epoxy with copper foil attached to the major surfaces of theboard, any other suitable substrate materials could be employedincluding, without limitation ceramics, glass, or metals coated with aninsulator. The metal layers of the board may be foil or could be formedby plating or vapor deposition or any other desired approach. While itis preferred to divide the substrate 32 to form the interconnects 30 byrouting, any desired dividing method can be used, including withoutlimitation, other machining methods, shearing, sawing, laser cutting orablation, etc. Further any desired number of interconnects 30 may beemployed in making the multi-chip module 10 to circuit substrate 22connection. The interconnect of this invention is generally adapted toelectrically interconnect two circuit boards, by being sandwichedbetween them, to create a board to board or board to daughter boardinterconnect. It is particularly adapted to attach multi-chip modules 10to a circuit substrate.

[0042] The interconnect member 32 of the present invention preferablycan be surface mounted in an automated fashion onto standard circuitpattern 62, 74 pads 66, 78 arranged in a conventional progression. Forexample, 0.035 inch round pads 66, 78 can be used on a 0.050 inchprogression. The pads 66, 78 may have any desired shape and are notlimited to round pads.

[0043]FIG. 3 depicts a simplified representation of a circuit layout 62,which is suitable for use both on the multi-chip module PCB 12 aspattern 74 as well as the circuit substrate PCB 22. The layout of theinterconnect member PCB 32 as shown in FIG. 4 employs a relativelysimple construction which begins with a double-sided 1 oz. copper foilclad FR-4 PCB 32, to create a series of 0.035″ by 0.050″ oblong pads 80on a 0.050″ by 0.065″ progression along the axes 82 and 84 on the topand bottom major faces 48, 50 (see also FIG. 9) of the strip or board.

[0044] While a rigid PCB strip is shown which provides a line ofinterconnect members, if desired a board could be employed to form rowsand columns of interconnect members, for later singulation. A strip typeapproach can also be used with a flexible PCB type material usingCapton, for example, as the core material. This would enable the stripof interconnect members 32 to be wound up in reel form for use in reelto reel manufacturing techniques as shown in FIG. 12. In FIG. 12 theinterconnects 30 are supported in the flexible PCB carrier which hassprockets 110 to allow measured advancement during assembly processing.In processing the interconnects would generally be severed from thestrip carrier 112 as the interconnects are placed on the module 10.

[0045] The board 32 is then drilled through the pads 80 on the top 48all the way through the pads 80′ on the bottom face 50 using anexemplary drill 100 size of about 0.032″ on about a 0.050″×0.080″progression to create the openings 86 as shown in FIGS. 5 and 12.Without the necessity of adding a solder mask, the holes 86 are thenplated by conventional electroplating, electroless plating, or any otherdesired technique. In this example electroplating the holes 86 creates abarrel platted connection 88 (see also FIG. 10) between the pads 80 onthe top face 48 and the pads 80′ on the bottom face 50 of the member 32.This plating 88 would be carried out in a conventional manner to obtaina nominal wall thickness t₁ of about 0.001 inch. This brings the sizeholes 86 to a nominal diameter of about 0.030″ diameter. As shown inFIG. 6 the member 32 is then divided by routing slots 102 alongside thecenter of the drilled holes 86 to provide the interconnect members 32.Thereafter a de-smearing operation may be carried out to debur theexposed metalization 88. Next as in FIGS. 7 and 14 the member 32 wouldbe processed through a Hot Air Solder Leveling (H.A.S.L.) operation toprovide a surface solder plating 106 of about 0.001″ build-up on themetalization 88 in the holes 86 and the pads 80, 80′. The solder plating106 would produce the equivalent of about a 0.028″ dia. finished hole 86size. Finally, the individual interconnect members 32 would besingulated as in FIG. 8, from the panel or strip, by any desiredconventional means such as, for example, shearing or sawing.

[0046] The process for using the interconnect 30 of this invention maybe exemplified as follows:

[0047] Due to the small size of the interconnect 30 a portion 46 of thesurface 48 of approximately 0.165 inch×0.080 inch has been incorporatedinto the interconnect 30 a to accommodate nozzle clearance for industrystandard Surface Mount Pick and Place Equipment. The interconnect 30 ofthis invention is also conducive to Tape & Reel packaging as in FIG. 12for high volume automated placement. Placement of the interconnect 30 onthe bottom side 48 of the multi-chip module would be accomplished bypanelizing and fixturing of the individual interconnects throughindustry standard SMT processes. The interconnects 30 would preferablybe the last components placed on the bottom face 48 of the module 10.They would be soldered to the module using a high temperature reflowsolder. Epoxy chip bonder can also be used to mate the interconnects 30to the module 10 in combination with the solder.

[0048] Mating of the module 10 to the main board 22 would beaccomplished by processing the main board through industry standard SMToperations using a lower temperature reflow solder. Reflow operationsfor soldering the module 10 to the main board would not require specialprocessing, since the module 10 with the interconnects 30 wouldpresumably be processed along with many other components mounted on themain board 22.

[0049] While the present invention has been described in connection withthe preferred embodiments of the various figures, it is to be understoodthat other similar embodiments may be used or modifications andadditions may be made to the described embodiment for performing thesame function of the present invention without deviating therefrom.Further, the arrangements described can be used with respect tocomponents other than connectors, that comprise housings formed ofinsulative materials which carry elements to be fused onto a PWB orother electrical substrate. Therefore, the present invention should notbe limited to any single embodiment, but rather construed in breadth andscope in accordance with the recitation of the appended claims.

What is claimed is:
 1. An interconnect for attaching a module to acircuit substrate comprising: an member elongated in a longitudinaldirection, said member having at least a first elongated side and asecond opposed and generally parallel elongated side, said first andsecond sides extending in said longitudinal direction; each of saidfirst and second sides having at least one portion having a series ofdepressions in said respective first and second sides extending inwardlyfrom a first outer surface of said first side and a second outer surfaceof said second side; and wherein said depressions are metallized to formleads.
 2. The interconnect as in claim 1 wherein said module is amulti-chip module and said depressions have a generally semi-cylindricalshape.
 3. The interconnect as in claim 1 wherein said module is amulti-chip module and wherein each of said first and second sidesextends from a first transverse end of said member to a secondtransverse end of said member; and wherein each of said sides includesat least one portion, intermediate said ends which is free ofdepressions.
 4. The interconnect as in claim 3 wherein said memberfurther includes third and forth opposed elongated sides extendingrespectively between said first and second sides and wherein the portionof each of the third and fourth sides associated with the depressionfree portions of the first and second sides is arranged for receiving apick and place assembly device.
 5. A multi-chip module circuit assemblycomprising: a multi-chip module having a plurality of electronicelements; a circuit substrate supporting thereon a conductive circuitpattern adapted for connection to said multi-chip module; at least oneinterconnect for attaching said multi-chip module to said circuitpattern on said circuit substrate, said interconnect comprising: amember elongated in a longitudinal direction, said member having atleast a first elongated side and a second opposed and generally parallelelongated side, said first and second sides extending in saidlongitudinal direction; each of said first and second sides having atleast one portion formed by a series of depressions in said respectivefirst and second sides extending inwardly from a first outer surface ofsaid first side and a second outer surface of said second side; andwherein said depressions are metallized to form leads which connect atleast one electronic element of said multi-chip module to saidconductive circuit pattern of said circuit substrate.
 6. The circuitassembly as in claim 5 wherein said depressions have a generallysemi-cylindrical shape.
 7. The circuit assembly as in claim 5 whereineach of said first and second sides extends from a first transverse endof said member to a second transverse end of said member; and whereineach of said sides includes at least one portion, intermediate said endswhich is free of depressions.
 8. The circuit assembly as in claim 7wherein said member further includes third and forth opposed elongatedsides extending respectively between said first and second sides andwherein the portion of each of the third and fourth sides associatedwith the depression free portions of the first and second sides isarranged for receiving a pick and place assembly device.
 9. The circuitassembly as in claim 5 wherein a plurality of said interconnect membersare connected between said multi-chip module and said circuit substrate.10. The circuit assembly as in claim 9 wherein said multi-chip moduleincludes a first major face and a second opposed major face and whereinfirst electronic elements are supported said first face and additionalsecond electronic elements are supported by said second face and whereinsaid interconnect members space said multi-chip module from said circuitsubstrate by an amount greater than the thickness of electronic elementsarranged on said multi-chip module between said multi-chip module andsaid circuit substrate.
 11. The circuit assembly as in claim 10 whereinat least two of said interconnect members connect said multi-chip moduleto said circuit substrate and wherein each of said interconnect membersis arranged toward a different edge of said multi-chip module.
 12. Aprocess for making an interconnect for attaching a multi-chip module toa circuit substrate comprising: providing a member elongated in alongitudinal direction; forming a series of circuit pads on opposingmajor faces of said member, said circuit pads being arranged in at leasttwo lines in said longitudinal direction on each of said major faces,with the circuit pads in a line on one major face of said member beingaligned with respective opposing circuit pads on the other major face ofsaid member; forming a series of openings in said circuit pads extendingthrough said member and at least one circuit pad on one of said majorfaces and at least another circuit pad on said opposing major face, saidopenings being arranged in said at least two lines; forming a conductivemetalization in said openings electrically connecting each of said onecircuit pads to a respective one of said another circuit pads; dividingsaid member along a generally central axis of said openings in said atleast two lines to provide at least one interconnect member having atleast a first elongated side and a second opposed and generally parallelelongated side, said first and second sides extending in saidlongitudinal direction; each of said first and second sides having atleast one portion formed by a series of metallized depressions in saidrespective first and second sides extending inwardly from a first outersurface of said first side and a second outer surface of said secondside; and wherein said depressions form leads
 13. The process as inclaim 12 wherein the step of forming said openings comprises drillingholes through said member and centrally of opposing circuit pads on theopposing faces of the member, whereby said depressions have a generallysemi-cylindrical shape.
 14. The process as in claim 13 wherein each ofsaid first and second sides extends from a first transverse end of saidinterconnect member to a second transverse end of said interconnectmember; and wherein a portion of each of said sides, intermediate saidends is free of depressions.
 15. The process as in claim 3 wherein saidmember is provided with third and forth opposed elongated sidesextending respectively between said first and second sides and whereinthe portion of each of the third and fourth sides associated with thedepression free portions of the first and second sides is formed forreceiving a pick and place assembly device.
 16. A process for attachinga multi-chip module to a circuit substrate comprising: providing amulti-chip module having a plurality of electronic elements; providing acircuit substrate supporting thereon a conductive circuit patternadapted for connection to said multi-chip module; providing at least oneinterconnect member for attaching said multi-chip module to said circuitpattern on said circuit substrate, said interconnect member comprising:a member elongated in a longitudinal direction, said member having atleast a first elongated side and a second opposed and generally parallelelongated side, said first and second sides extending in saidlongitudinal direction; each of said first and second sides having atleast one portion formed by a series of depressions in said respectivefirst and second sides extending inwardly from a first outer surface ofsaid first side and a second outer surface of said second side; whereinsaid depressions are metallized to form leads for connecting at leastone electronic element of said multi-chip module to said conductivecircuit pattern of said circuit substrate; forming a sub-assembly byattaching said at least one interconnect member to said multi-chipmodule to make a desired electrical connection between at least one ofsaid leads of said interconnect member and said at least one electronicelement; and attaching the sub-assembly to the circuit substrate to makeat least one desired electrical connection between said at least onelead of said interconnect member and said conductive circuit pattern ofsaid circuit substrate.
 17. The process as in claim 16 furthercomprising having each of said first and second sides of saidinterconnect member extend from a first transverse end of said member toa second transverse end of said member; and forming in each of saidsides at least one portion, intermediate said ends which is depressionfree.
 18. The process as in claim 17 further comprising providing saidinterconnect member with third and forth opposed elongated sidesextending respectively between said first and second sides and whereinthe portion of each of the third and fourth sides associated with thedepression free portions of the first and second sides is formed toreceive a pick and place assembly device.
 19. The process as in claim 18wherein a plurality of said interconnect members are attached to saidmulti-chip module and said circuit substrate.
 20. The process as inclaim 19 wherein said multi-chip module includes a first major face anda second opposed major face and wherein first electronic elements areprovided on said first face and additional second electronic elementsare provided on said second face and employing said interconnect membersto space said multi-chip module from said circuit substrate by an amountgreater than the thickness of electronic elements arranged on saidmulti-chip module between said multi-chip module and said circuitsubstrate.
 21. The process as in claim 20 further comprising providingat least two of said interconnect members to connect said multi-chipmodule to said circuit substrate and attaching each of said interconnectmembers toward a different edge of said multi-chip module.